The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 1995

Filed:

Jun. 27, 1994
Applicant:
Inventor:

Hung N Nguyen, Bensalem, PA (US);

Assignee:

AT&T Corp., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H01L / ;
U.S. Cl.
CPC ...
2281231 ; 2282341 ; 2281241 ;
Abstract

For soldering together two surfaces of a workpiece by means of solder, and without the use of a solder flux, apparatus includes means for preheating the workpiece and solder to a temperature close to but less than the solder fusing temperature, and means for directing two jets of a hot, non-oxidizing gas towards the preform from opposite sides thereof and along a straight line axis. The hot gas melts the solder and causes flow of the melted solder between the two surfaces in directions generally transverse to the axis of the two gas jets.


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