The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 1995
Filed:
Nov. 18, 1994
Tetsuo Kawakita, Takatsuki, JP;
Kenzo Hatada, Katano, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
The present invention relates to connecting electronic components using bump electrodes to connect electronic components such as semiconductors with the patterning electrodes of a circuit board. In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated within bump electrodes. The bump electrodes disclosed by the present invention have resin bumps with numerous cavities disposed within and covered by a low melting point metal layer. According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it is possible to absorb the variations through the elasticity presented by the bump electrodes. It is also possible to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.