The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 1995
Filed:
Mar. 21, 1994
Walter H Brendecke, Phoenix, AZ (US);
Kenneth H Schmidt, Mesa, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A multichip electronic module comprising a base for holding various components and a lid for sealing the module, is temporarily closed by a reworkable seal made from a thermoplastic material. The seal is hermetic so that the module can be tested under ambient conditions approximating actual use. If the module fails the functional test, the lid is easily removed for repair. The thermoplastic material is located in a special grove near the periphery of the base or lid next to the mating surfaces which form part of a final seal for the module. After a module has been repaired, the lid is finally soldered or welded to the base using portions of these mating surfaces which are free of the thermoplastic material. There is no need to remove the thermoplastic material used for the temporary seal.