The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 1995
Filed:
Apr. 12, 1993
Toray Industries, Inc., Tokyo, JP;
Abstract
A cured resin product has a strain energy release rate (GIC) of at least 400 J/m.sup.2, a flexural modulus of at least 300 Kg/mm.sup.2, and a glass transition temperature (Tg) of at least 120.degree. C. The cured resin composition comprises a thermoset resin component (A), optionally including a curing agent (B), and a thermoplastics resin component (C), the thermoplastics resin and thermoset resin components (C) and (A) being present at least partly in respective phases (1) and (2) each being elongate in at least one direction and each preferably having a three dimensionally continuous structure. Phase (1) may contain a silicon containing compound providing a concentration therein of elemental silicon higher than that in any other phase, and/or the cured resin product may additionally include regions where one of the phases (1) and (2) essentially surrounds the other. The thermoplastics resin (C) may be a block or graft copolymer comprising a molecular chain compatible with, and molecular chain incompatible with, the thermoset resin (A). A composition containing the above components (A) to (C) may be compounded with fibrous reinforcement to provide a prepreg curable to obtain a high strength fiber reinforced plastics material.