The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 1995
Filed:
Sep. 28, 1994
Applicant:
Inventors:
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08K / ;
U.S. Cl.
CPC ...
523443 ; 525109 ; 525122 ; 525476 ; 525481 ; 525482 ; 525487 ; 528 27 ;
Abstract
Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.
Kayaba, Keiji. (1995). Semiconductor device-encapsulating epoxy resin composition containing (U.S. Patent No. 5476884). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5476884
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile