The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 1995

Filed:

Dec. 21, 1993
Applicant:
Inventors:

Isao Yabe, Saitama, JP;

Kazuo Sato, Yamanashi, JP;

Hajime Omata, Yamanashi, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
2643287 ; 26432812 ;
Abstract

A method for manufacturing a substrate for an IC card in which, after a synthetic resin is filled into a cavity in an IC card substrate forming mold, or after a core pin for forming an IC module housing recessed section in the cavity in an IC card substrate forming mold is caused to project as far as an intermediate position, and the synthetic resin is filled into the cavity, the core pin is further caused to project to a specified position to form the IC module housing recessed section while the synthetic resin is in the mobile state.


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