The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 1995
Filed:
Aug. 11, 1994
Applicant:
Inventor:
Holger Huebner, Baldham, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C / ;
U.S. Cl.
CPC ...
1566441 ; 1566491 ; 216 17 ; 216 18 ; 216 19 ; 216 39 ; 437228 ; 437203 ;
Abstract
For filling via holes that extend onto interconnects to be contacted in a semiconductor layer structure, the interconnects are connected to a conductive layer through auxiliary via holes. The via holes are filled with metal by electro-deposition, whereby the interconnects are wired as a cooperating electrode in an electrolyte via an auxiliary contact to the conductive layer. Subsequently, the conductive layer is removed.
Huebner, Holger. (1995). Method for filling via holes in a semiconductor layer structure (U.S. Patent No. 5474651). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5474651
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile