The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 1995
Filed:
May. 04, 1993
Theodore R Golubic, Phoenix, AZ (US);
Udey Chaudhry, Mesa, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor chip module is formed by providing at least one semiconductor chip and a semiconductor substrate and bonding the semiconductor chip to the semiconductor substrate without the use of an epoxy or a metallic layer to create a bond between the semiconductor chip and the semiconductor substrate. The semiconductor chip of the semiconductor chip module is electrically connected to an external, electrical interconnection system. The semiconductor substrate has similar thermal properties to the semiconductor chip, this thermal mismatch present between a semiconductor chip and a metallic heatsink in conventional external, electrical interconnection systems is eliminated.