The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 1995

Filed:

Jun. 30, 1994
Applicant:
Inventors:

Sunao Fukutake, Okayama, JP;

Kazuhiko Ohashi, Okayama, JP;

Akira Urakami, Okayama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174258 ; 174250 ; 174259 ;
Abstract

A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.


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Fukutake, Sunao. (1995). Printed circuit board with a coverlay film (U.S. Patent No. 5473118). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5473118

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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