The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 1995

Filed:

Jun. 20, 1994
Applicant:
Inventors:

Michael R Strong, Midland, MI (US);

Martin E Cifuentes, Midland, MI (US);

Bernard VanWert, Midland, MI (US);

William J Schoenherr, Midland, MI (US);

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
525477 ; 528 17 ;
Abstract

A moisture-curable silicone hot melt pressure sensitive adhesive composition is disclosed, said composition comprising: (A) a solid alkoxy functional organopolysiloxane resin containing curing radicals of the formula --ZSiR.sup.1.sub.x (OR.sup.2).sub.3-x ; wherein R.sup.1 is a monovalent hydrocarbon radical, R.sup.2 is selected from the group consisting of a alkyl radical and alkoxyalkyl radical, Z is a divalent linking radical, and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radical selected from the group consisting of alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25.degree. C. of 20 to <100,000 mm.sup.2 /s, and the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; and (C) sufficient catalyst to accelerate the cure of said composition; said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.


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