The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 1995
Filed:
Jan. 25, 1993
Hirofumi Uchida, Yamato-Koriyama, JP;
Kazuya Fujita, Nabari, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A transfer molded semiconductor method arranges a semiconductor chip on a flat die pad so that, at least one predetermined edge surface of the semiconductor chip extends or protrudes over a corresponding edge of the flat die pad. The predetermined edge of the die pad is arranged on the opposite side of a gate beneath a lead frame at the other side. The arrangement suppresses the formation of voids at a side surface of the semiconductor chip, e.g., the side surface opposite the gate at which resin is injected.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile