The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 1995
Filed:
May. 28, 1993
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A high-solubility and high-adhesion poly(amide-imide-ester) resin prepared from a monomer composition comprising: (a) a diisocyanate such as diphenylmethane 4,4'diisocyanate; (b) a trimellitic anhydride; and (c) a bis-anhydride of trimellitic anhydride such as 1,2 bis(trimellitate)ethane dianhydride, dissolved in an appropriate solvent system. Each of the trimellitic anhydride and the bisanhydride of trimellitic anhydride constitutes 1 to 40%, on a molar basis, of the monomer composition and the amount of the diisocyanate is about 1.0 to 1.2 times, also on a molar basis, the sum of the trimellitic anhydride and the bis-anhydride of trimellitic anhydride. In an alternate embodiment, a fourth component (d) diacid such as isophthalic acid can be added to the monomer composition. After the polymerization reaction, the poly(amide-imide-ester) resin so produced can be diluted with a variety of organic solvents, such as xylene and dimethylacetamide, etc., and directly coated onto a copper foil to make polymer/metal laminates without going through an intermediate step involving polyamic acid.