The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 1995
Filed:
Apr. 21, 1995
Yutaka Tsukada, Shiga, JP;
Yasukazu Kobayakawa, Shiga, JP;
Yoji Maeda, Shiga, JP;
Shuhei Tsuchita, Kusatsu, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic package assembly wherein lead wires serve to connect conductors on a first substrate (e.g., ceramic) having a semiconductor device (e.g., IC chip) coupled to the conductors and positioned on the substrate, to respective conductors on a second substrate (e.g., a printed circuit board). The lead wires are secured to three different surfaces (e.g., top, side and bottom) of the first substrate, and include curved projection portions for being directly connected to the second substrate conductors.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile