The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 1995
Filed:
Dec. 15, 1994
Seok-Ho Song, Daejeon, KR;
Sang-Don Jung, Daejeon, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Abstract
The present invention discloses an optical back-board interconnection module scheme applying optical technique in a back-board interconnection module scheme for distribution of communication signals among opto-electronic integrated circuit (OEIC) boards of data communication network or computer systems with ultra-high speed. The present invention provides a back-board interconnection scheme having out-coupling uniformity level of optical power of below 1% and total out-coupling efficiency of more than 99%, and a method for designing a focusing grating coupler (FGC) array used as an important component in the back-board interconnection scheme and FGC standard specification obtained by such a method. When the inventive module is applied to the back-board interconnection scheme to couple communication signals with ultra-high speed performance among a plurality of opto-electronic integrated circuit boards in the high speed data communication network or high speed computer systems, optical signals transmitted through data bus lines at an ultra-high speed of more than several gigabits per sec. may be distributed to a plurality of OEIC boards. Moreover, the number of data transmission lines that may be integrated per unit area may be increased.