The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 1995
Filed:
Feb. 09, 1994
Applicant:
Inventors:
Atsushi Yoshimura, Yokohama, JP;
Hiroshi Shibata, Yokohama, JP;
Fumio Takahashi, Kitakami, JP;
Kuniaki Tsurushima, Atsugi, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
B21F / ;
U.S. Cl.
CPC ...
140105 ;
Abstract
An outer lead bending apparatus comprises a fixed unit, a movable unit movable toward and away from the fixed unit, a first die detachably mounted on one of the fixed unit and movable unit and holding a semiconductor package devise in place, and a second die detachably mounted on the other unit and, when the movable unit is driven toward the fixed unit, bending, together with the first die, the outer leads of the semiconductor package devise into a given configuration.