The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 1995
Filed:
Mar. 13, 1992
Timothy Bowman, Parkersburg, WV (US);
Charles N Domigan, Coolville, OH (US);
Robert W Hadfield, Parkersburg, WV (US);
J David Harmon, Vienna, WV (US);
James E Sheridan, Williamstown, WV (US);
Walker Systems, Inc., Parkersburg, WV (US);
Abstract
This patent discloses a method and apparatus for activation of services in a concrete floor of an office building from below floor slab distribution systems. Void-forming boxes that are secured to a conventional metal deck sheet and surrounded by the concrete floor slab provide chambers in which in-floor activations are mounted. An insulating block in the void-forming box restores fire resistance, prior to installation of an activation kit, that is lost by displacement of concrete by the void-forming box. An in-floor activation kit may be installed within the void-forming box and connected to a below floor slab distribution system through an activation opening cut in the metal deck sheet. Connection hardware is secured to the metal deck sheet for connection to a conventional below-floor slab service distribution system providing communication from the interior of the void-forming box to the below-floor slab service distribution system. Void-forming boxes mounted to the metal deck sheet may be connected by conduit in a conventional manner allowing conductors to be routed from a void-forming box connected to a below floor slab service distribution system to another void-forming box through connecting conduit.