The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 1995
Filed:
Jul. 07, 1994
Applicant:
Inventors:
Nobuyuki Arakawa, Kanagawa, JP;
Takashi Segawa, Kanagawa, JP;
Moriyoshi Kaneko, Tokyo, JP;
Kazuki Miyairi, Nagano, JP;
Kazutoshi Takayama, Nagano, JP;
Assignees:
Sony Corporation, Tokyo, JP;
Nissei Plastic Industrial Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
425186 ; 4251 / ; 425542 ; 425810 ; 264107 ;
Abstract
A disk substrate molding die is provided in which the quantity of eccentricity of a stamper can be reduced to a small value. The molding die includes a member having mounted thereon a thin plate (19) carrying thereon a recorded transfer signal and an adjusting device consisting of a plurality of pairs of adjusting blocks, each formed of movable blocks (9a) and (9b) and blocks (10a) and (10b) having adjacent surfaces inclined in the moving direction of the movable blocks and common to one another.