The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 1995
Filed:
Mar. 23, 1993
Toshio Isono, Tokyo, JP;
NEC Corporation, , JP;
Abstract
Disclosed is a semiconductor integrated circuit device with an electrode pad having a lower conductive film (second aluminum film) formed on a semiconductor substrate, an upper conductive film (third aluminum film) formed through an interlayer insulating film (second interlayer insulating film) on the lower conductive film. The upper conductive film is electrically connected to the lower conductive film by a minute through hole, and extends to a planar region where the lower conductive film is not present. That extending portion of the upper conductive film serves as a wire bonding portion. This design allows the through hole to be formed as small as the inner through hole of the integrated circuit, so that this electrode pad will have an improved bonding characteristic while being able to cope with a through-hole filling step.