The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 1995
Filed:
Nov. 24, 1992
Yutaka Shinbo, Hino, JP;
Takeshi Kajimoto, Takarazuka, JP;
Mitsuteru Kobayashi, Hanno, JP;
Katsuyuki Sato, Akishima, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In an electronic circuit system unit having a semiconductor integrated circuit unit on a wafer scale, a semiconductor wafer (a semiconductor integrated circuit unit on a wafer scale) and a print wiring substrate are laid to overlap each other and semiconductor pellets are mounted on the print wiring substrate in the overlapping area of the print wiring substrate and the semiconductor wafer. In said electronic circuit system unit, an area being a part of the periphery of the semiconductor wafer is protruded from the periphery of the print wiring substrate being placed to overlap the semiconductor wafer, and the semiconductor wafer and the print wiring substrate are electrically connected to each other in an area being a part of the protruded part through wires.