The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 1995
Filed:
Jun. 10, 1994
Naoki Miyazaki, Fukuoka, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A ball forming apparatus free from parameter variations introduced in setting spark discharge control parameters wherein the variations may be largely of operator-dependent or apparatus-dependent nature. To control discharge parameters, digital data for controlling discharge are transmitted in serial communications from a wire bonder controller to the ball forming apparatus, and the digital data are used to set parameters such as discharge current, discharge time, heat development and the like. The discharge state data acquired during spark discharge is transmitted in serial communications from the ball forming apparatus to the wire bonder controller so that the above parameters are used for feedback control. Irregularity or difference in the ball size that may vary from apparatus to apparatus is eliminated, and an improved bondability results. Unnecessary bondings are reduced, and an improved manufacturing efficiency in semiconductor field is achieved.