The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 1995
Filed:
Jul. 11, 1994
Kimihiro Wakabayashi, Ebina, JP;
Noriyuki Nebashi, Ebina, JP;
Fuji Xerox Co., Ltd., Tokyo, JP;
Abstract
A method for fabricating a metal member having a plurality or multitude of fine holes comprises forming a repeatedly usable master which includes a conductive substrate and non-conductive portions used to form the fine holes and fixedly deposited on the conductive substrate, subjecting the master to electrodeposition to form an electrodeposition film which has non-electrodeposited fine holes in position corresponding to the non-conductive portions, and separating the electrodeposition film from the master. In the master formation step, the non-conductive portions are so formed to have projections from the surface of the conductive substrate. The electrodeposition is effected so that the electrodeposition film is deposited about the side surfaces of each projection as exposing at least a top of the projection. The fine holes of the separated electrodeposition film have invariably a constant dimensional accuracy without suffering any influence of the electrodeposition conditions. The formation density of the fine holes is free of any limitation as will be caused by the thickness of the electrodeposition film.