The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 1995
Filed:
Feb. 22, 1994
William A Wentland, Jr, Bristol, CT (US);
Alan M Hansen, Higganum, CT (US);
Ramon W Rosati, Simsbury, CT (US);
Dana Corporation, Toledo, OH (US);
Abstract
An enclosure for protectively housing a printed circuit board in an electronic circuit module includes a base having an internal surface and an external surface. The base includes a pair of raised mounting pads formed on the internal surface which define respective mounting surfaces. A pair of channels are also formed on the internal surface of the base. The enclosure further includes a cover having a panel portion and a pair of end wall portions. Respective projections are formed on each of the end wall portions which define grooves therein. The cover is assembled to the base by inserting the edges of the end wall portions provided on the cover into the channels provided on the base. A plurality of spring clips is disposed within each of the grooves provided on the cover. The spring clips can be positioned at any desired location along each of the grooves. When the cover is connected to the base, the spring clips urge electrical components mounted on the printed circuit board into abutment with the mounting pads provided on the base. As a result, a firm mechanical engagement is maintained between the electrical components and the mounting pads. The mounting pads conduct heat generated by electrical components away therefrom for dissipation.