The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 1995

Filed:

Nov. 22, 1994
Applicant:
Inventors:

John Siemon, Woodbury, CT (US);

Howard Reynolds, Waterbury, CT (US);

Assignee:

The Siemon Company, Watertown, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
361785 ; 361752 ; 361796 ; 361748 ; 439 92 ; 439101 ; 439 57 ; 439 79 ;
Abstract

An electrically enhanced wiring block with break test capability employs a printed circuit board which includes integrally defined transmission lines and capacitive elements designed to improve impedance characteristics and electrical balance between interconnected wiring and connecting strips and thereby optimize its transmission performance. The transmission lines consist of impedance controlled circuitry with integral capacitive elements that are provided by means of a novel use of plated through holes. The holes may be sized, spaced and interconnected in various configurations to generate the desired capacitance. Two rows of connecting blocks with a row of connecting strips therebetween are mounted to one side of the circuit board preferably by solderless connectors and are interconnected by circuitry on the circuit board. The capacitive elements are connected between selected leads of the connecting blocks and connecting strips by the impedance controlled circuitry. The circuit board is mounted onto a bracket which is itself mounted onto a wiring block base. A series of disconnect plugs are provided for breaking electrical connection between selected connecting block positions by separating contacts with selected connecting strip positions. Also, a series of modular jack test assemblies are provided for testing and at other times when modular jack connection is desired. The modular jack test assembly comprises a modular jack mounted on a circuit board having edge contacts for mating with the contacts of the connecting strip.


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