The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 1995

Filed:

Feb. 08, 1994
Applicant:
Inventor:

Shigeichi Izumi, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361707 ; 174252 ; 257713 ; 361719 ;
Abstract

A printed circuit board assembly wherein a plurality of electronic parts including a heat generating part are mounted on a printed circuit board. At a portion of the printed circuit board at which the heat generating part is to be mounted, a recess is formed and a through-hole is formed substantially at the center of a bottom wall of the recess. A heat radiation member has a projection fitted in the through-hole of the printed circuit board, and a mounting portion provided around the projection for contacting with the bottom wall of the recess of the printed circuit board and securely mounted on the bottom face of the recess by means of solder. The rear face of a package of the heat generating part is securely mounted on the heat radiation member by means of solder.


Find Patent Forward Citations

Izumi, Shigeichi. (1995). Printed circuit board assembly having high heat radiation property (U.S. Patent No. 5459639). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5459639

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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