The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 1995
Filed:
Sep. 26, 1994
Masaru Ando, Kamakura, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A semiconductor module device according to the present invention includes a disk-shaped DBC circuit board which are divided into, e.g., six sectorial DBC circuit boards. A plurality of semiconductor pellets are arranged in a staggered fashion on each of the sectorial DBC circuit boards. Externally leading electrodes are provided at the respective innermosts of the sectorial DBC circuit boards, and externally leading power terminals, which are connected to the externally leading electrodes, are extracted from the central part of the DBC circuit board. With this constitution, the distances between the externally leading power terminals and the sectorial DBC circuit boards can be minimized, and the distances between the externally leading power terminals and the semiconductor pellets on the sectorial DBC circuit boards can be uniformed, with the result that the efficiency and reliability of the module device can be improved. Since the DBC circuit board is shaped like a disk, it can be protected from breakage due to the stress concentrated when the device is mounted.