The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 1995
Filed:
Oct. 29, 1993
Applicant:
Inventors:
Claude Blais, Granby, CA;
Pedro A Chalco, Yorktown Heights, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
21912185 ; 21912166 ; 2191216 ; 437173 ; 437224 ; 437219 ;
Abstract
A method for encapsulating a semiconductor chip. The method includes the steps of first positioning a chip over a laser-curing cavity, and then dispensing a predetermined amount of encapsulant over the chip. Sequential steps include synchronizing a firing of a laser pulse immediately after the dispensing step, and curing the encapsulant by conducting heat generated by the laser pulse, through the chip.
Blais, Claude. (1995). Semiconductor chip packaging method which heat cures an encapsulant (U.S. Patent No. 5457299). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5457299
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile