The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 1995

Filed:

Sep. 29, 1993
Applicant:
Inventors:

James E Bebak, Hamburg, NY (US);

Loren E Saar, Elmwood Park, IL (US);

Frank A Sardina, Freedom, NY (US);

Joseph J Vinci, Snyder, NY (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 97 ; 427294 ; 427296 ; 427282 ; 427299 ; 427384 ;
Abstract

An improved method for fabricating a circuit element through a substrate permits fabrication of large geometry vias between substrate sides. The improved method includes disposing a substrate (327) between two compressible layers (317, 339). Each of the layers (317, 339) has at least one aperture (345, 321) disposed therethrough. The substrate (327), has at least one via (333) aligned between the apertures (345, 321) where the via has an area smaller than an area of the apertures (345, 321). Next, a coating, preferably a liquid circuit element material (351) is disposed into one of the apertures (321) of one of the two compressible layers (339). A pressure (405) is applied between the two compressible layers (317, 339) causing the liquid circuit element material (351) to flow between the two compressible layers (317, 339), thereby coating the at least one via (333) of the substrate (327), thus providing an interconnect (609, 611) of the coating through the substrate (327). The compressed layers (317, 339) confine the spreading of the liquid circuit element material (351). Preferably, the substrate (327) is then cured or fired, thereby changing the liquid circuit element material (351) into a solid state.


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