The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 1995

Filed:

Jun. 30, 1994
Applicant:
Inventors:

Anthony B Suppelsa, Coral Springs, FL (US);

Robert F Darveaux, Coral Springs, FL (US);

Michael L Weiss, Coral Springs, FL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257467 ; 257666 ; 257696 ; 257747 ; 257750 ; 257762 ; 257766 ;
Abstract

A plastic leaded semiconductor package (20) has a semiconductor device (614) encapsulated in the package and mounted to a lead frame (612). The lead frame has a plurality of leads (622) that extend beyond the body (610) of the encapsulated package. Each of the plurality of leads is made from a metal having a predetermined coefficient of thermal expansion. A second metal (627) with a different coefficient of thermal expansion is disposed on at least one portion of each of the leads.


Find Patent Forward Citations

Suppelsa, Anthony. (1995). Leaded semiconductor package having temperature controlled lead length (U.S. Patent No. 5455446). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5455446

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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