The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 1995
Filed:
May. 09, 1994
Applicant:
Inventors:
Katugi Kitagawa, Saitama, JP;
Akira Shinozuka, Chiba, JP;
Assignee:
Somar Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08K / ;
U.S. Cl.
CPC ...
523443 ; 525533 ;
Abstract
A thermosetting epoxy resin based powder composition composed of an epoxy resin, a high-melting point polycarboxylic acid anhydride and calcium silicate as a filler, the high-melting point polycarboxylic acid anhydride comprising fine particles of 5 to 149 .mu.m in average size that have reacted with the epoxy resin in the molten state on their surfaces.
Quick Actions:
Kitagawa, Katugi. (1995). Powder composition of epoxy resin, high melting acid anhydride and (U.S. Patent No. 5455290). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5455290
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile