The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 1995
Filed:
Aug. 04, 1993
Applicant:
Inventors:
Dieter Nagele, Filderstadt, DE;
Manfred Weinacht, Dettingen/Teck, DE;
Klaus Farber, Kirchheim/Teck, DE;
Assignee:
Daimler-Benz Aerospace AG, Munchen, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257414 ; 257415 ; 257431 ; 257432 ; 257433 ; 257434 ;
Abstract
System for packaging integrated circuits, especially sensors, in a housing, which also comprises multicontact bondings, especially hybrid ICs for three-dimensional arrangement of modules, wherein sensors (4, 5) are arranged at an angle in relation to one another on the base plate or the substrate (1). The sensors are contained in the single housing together with contact pins (pins) (2), and are connected in one plane by automatic bonding.
Nagele, Dieter. (1995). Bonding and encapsulated three dimensional hybrid integrated circuit (U.S. Patent No. 5453638). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5453638
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile