The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 1995

Filed:

Jun. 20, 1994
Applicant:
Inventors:

Ruriko Tsuneta, Kokubunji, JP;

Hiroshi Kakibayashi, Nagareyama, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J / ;
U.S. Cl.
CPC ...
250311 ; 25044211 ;
Abstract

A composition change and a 3-dimensional strained structure in an interface or thin film of a layered thin film specimen are detected with a resolution of atom order and quantitatively analyzed. An accelerated electron beam is impinged upon a specimen cleaved in a wedge form. An equal thickness fringe appearing on a transmitted image is detected. By utilizing such a phenomenon that the distance t of the equal thickness fringe is changed by a lattice plane inclination, angle distribution of lattice plane inclination is measured. An analysis of the strained structure is made. Furthermore, processing is conducted so that the equal thickness fringe may represent only the composition change, and a quantitative analysis of the composition distribution is also made. By estimating the composition change and strained structure in the heterointerface and thin film with a resolution of atom order, relations between characteristics and the composition change and strained structure of a strained superlattice device or the like can be elucidated. Thus, not only defective analysis can be made, but also information concerning optimization of the process condition and device structure is obtained.


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