The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 1995

Filed:

Aug. 27, 1993
Applicant:
Inventor:

Uya Shinji, Kyungki-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437 11 ; 437 24 ; 437 53 ;
Abstract

A method for manufacturing a silicon semiconductor device with a high contamination sensitivity to heavy metals, such as Si-CCD solid state image sensors, wherein a gettering site is formed in an element isolation region present near an element region or the like, a non-depleted n.sup.+ or p.sup.+ region, a region to be removed or isolated from the surface of a semiconductor substrate in a subsequent process. This method makes it possible to form semiconductor devices while reducing the contamination of silicon substrate surfaces by heavy metals. The method also realizes the manufacture of silicon semiconductor devices exhibiting a stable device characteristic and having reduced defects.


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