The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 1995
Filed:
Jul. 07, 1993
Masato Ujiie, Tokyo, JP;
NEC Corporation, , JP;
Abstract
A semiconductor device which includes an insulating substrate having a semiconductor chip mounted on a first face thereof, and an insulating first package member fixed on the first face with surrounding the semiconductor chip. An insulating second package member is fixed on a second face of the substrate, which is opposite to the first face. The chip is housed in a first cavity formed by the substrate and the first package member. The first cavity is sealed by a first sealing member fixed on an opening end of the first package member. The first and second package members are respectively fixed on both sides of the substrate, so that the package is substantially or nearly symmetrical in structure in relation to the substrate. Thus, stresses in the substrate due to expansion and contraction thereof are almost or substantially balanced with each other in a firing or burning process, and as a result, warpage of the substrate is difficult to be generated and flatness of the mounting face of can be improved.