Machine for applying heat shrinkable bands to containers

Abstract

The present invention entails a band application machine for applying tamper-evident bands and other bands about the circumference of a container. The band application machine directs a supply strip of banding material to a curing mechanism which cuts the supply strip into a series of cut bands. A band transfer system transfers the cut band to a container being conveyed adjacent to the band application machine on a conveyor assembly. The band transfer system includes a gripping mechanism having a pair of opposing gripper arms with attached suction cups. The gripper arms and attached suction cups engage opposite sides of a closed band and then move apart to open the band. An actuator laterally positions the gripper mechanism to a position where the grippers extend over the conveyor assembly. A tilting actuator rotates the gripper mechanism from a generally horizontal position to a tilted position where a lower section of the gripped band extends into the pathway of the passing containers. A shoe assembly is designed to be longitudinally moveable along the conveyor system from a retracted position to an extended position. The shoe assembly is positioned in the retracted position as the gripping mechanism is moved from the generally horizontal position to the tilted position such that the shoe assembly does not interfere with the positioning of the gripping mechanism. In the extended position, the shoe assembly lies over a band held in the tilted position and effectively limits its upward movement as a passing container strips the band from the tilted position.