The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 1995
Filed:
Jan. 17, 1995
Kazunori Katoh, Tokyo, JP;
Gen Murakami, Kodaira, JP;
Hiromichi Suzuki, Kodaira, JP;
Takayuki Okinaga, Kodaira, JP;
Takashi Emata, Kodaira, JP;
Osamu Horiuchi, Kodaira, JP;
Dia Nippon Printing Co., Ltd., Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi VLSI Engineering Corp., Tokyo, JP;
Abstract
A leadframe according to this invention is formed by bonding a single leadframe with a substrate using adhesive film or double-sided adhesive resin film, which is divided and attached to two or more predetermined points between them. This reduces the quantity of gas or contaminants generated from adhesives. Also, this results in the reduction of the stress generated during heat treatment of the leadframe and also in the elimination of warping of the lead frame due to thermal stress. Cracking does not occur on the resin because resin is removed easily and assuredly, and no air is left behind. This contributes to high reliability and increased productivity. The lead frame is further formed by bonding a plurality of metal substrates of different materials to single leadframe. This through more stable thermal behavior high reliability.