The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 1995
Filed:
Apr. 07, 1994
Toyoji Tomita, Mie, JP;
Masahiro Aoki, Mie, JP;
Takeo Tsukamoto, Mie, JP;
Takeshi Awata, Mie, JP;
Ryutaro Hayashi, Mie, JP;
Mitsubishi Yuka Badische Co., Ltd., Yokkaichi, JP;
Abstract
An aqueous dispersed resin composition is disclosed, comprising (A) an aqueous dispersion of carbonyl-containing resin particles having an inner layer and an outermost layer, which is obtained by emulsion polymerization of a monomer mixture comprising (a) not less than 0.5% by weight of a carbonyl-containing monomer containing at least one aldo group or keto group and one polymerizable unsaturated double bond in the molecule thereof, (b) not less than 0.5% by weight of an ethylenically unsaturated carboxylic acid, (c) not more than 99% by weight of a monomer having a water-solubility of not more than 8 g/100 ml at 20.degree. C., and (d) not more than 99% by weight of an unsaturated monomer other than the monomers (a) to (c) in an aqueous medium in the presence of dispersed resin particles serving as an inner layer, (B) a hydrophilic compound comprising a hydrazine derivative containing at least two hydrazino groups in the molecule thereof, and (C) an epoxy-containing compound containing at least two epoxy groups in the molecule thereof, in which the resin constituting said outermost layer of said carbonyl-containing resin particles has a degree of solubilization of at least 5% by weight, and the resin constituting the whole resin particles has a degree of solubilization of from 4 to 50% by weight. The composition is easily crosslinked at room temperature to provide a film excellent in water resistance, resistance to whitening on contact with water, antiblocking properties, heat resistance, solvent resistance, adhesion and hardness, and is particularly useful as an adhesive composition.