The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 1995
Filed:
Feb. 04, 1994
Applicant:
Inventor:
Akiteru Rai, Nara, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437183 ; 437209 ; 437246 ; 257737 ; 257738 ; 257779 ;
Abstract
In mounting a semiconductor chip on a circuit board by a flip chip bonding method, an improved mounting method holds the circuit with a warp prevention device, on which the semiconductor chip is placed, while the circuit board is treated with heat for the reflow of the solder bumps. As a result, the circuit board is prevented from warping when heated at a temperature at which the solder bumps melt.