The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 1995
Filed:
Nov. 04, 1994
Masanori Nishiguchi, Yokohama, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
The heat sink is mounted on a semiconductor chip module sealed hermetically with a cap. The heat sink comprises an absorption means for absorbing the heat generated from a semiconductor chip, being inserted into an opening formed in a cap so as to make contact with a semiconductor chip sealed hermetically within a semiconductor chip module; a heat dissipation means exposed outside the cap for dissipating the heat of the semiconductor chip absorbed by the absorption means; and a contact surface disposed between the absorption means and the heat dissipation means and fixed on the upper surface of the cap, and the contact surface at least being coated with an adhesive material. The heat sink mounted on a semiconductor chip module can stably dissipate the heat produced from a semiconductor chip sealed hermetically within the semiconductor chip module.