The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 1995
Filed:
Jul. 01, 1994
MCNC, Research Triangle Park, NC (US);
Abstract
A temporary substrate for solder bumps may be used to transfer solder bumps to a microelectronic device. The temporary substrate includes a solder nonwettable surface and a plurality of conductive vias therein. A solder bump is formed on each of the conductive vias and is electrically and mechanically connected thereto. The solder bump extends over the solder nonwettable surface to produce a solder bump cross-sectional area which is greater than the cross-sectional area of the conductive via. A microelectronic device is placed adjacent the temporary substrate with each input/output pad adjacent a respective solder bump. An electrical and mechanical connection is formed between the solder bump and the input/output pad, and the microelectronic device is separated from the temporary substrate with the solder bump remaining connected to the input/output pad. The temporary substrate can also be used for burn-in and testing of microelectronic devices and rework on multichip modules.