The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 1995
Filed:
Oct. 15, 1992
William N Thanos, San Jose, CA (US);
Steven L Kaczeus, San Jose, CA (US);
James D Fahey, San Jose, CA (US);
TEAC Corporation, Tokyo, JP;
Pont Peripherals Corporation, Sunnyvale, CA (US);
Abstract
A low profile disk drive assembly comprises an enclosure having a sealed volume substantially laterally displaced with respect to a circuit volume. The sealed volume has an extension which extends laterally toward one corner portion of the enclosure whereas the circuit volume is disposed substantially within an adjacent corner portion of the enclosure. The sealed volume contains one or more disks and a read/write head actuator assembly. A flexible circuit, which couples to the read/write head actuator assembly inside the sealed volume, extends from inside sealed volume, through a wall of the enclosure which separates the sealed volume from the circuit volume, across the circuit volume, and to an interface connector. The interface connector may be used to connect the disk drive assembly to a system with which the disk drive assembly is to operate. A multichip module is mounted on one side of the flexible circuit inside the circuit volume. Preamplification circuitry is mounted on one side of the flexible circuit inside the sealed volume. The flexible circuit, the multichip module, and the preamplification circuit may comprise a separately testable subassembly. In some embodiments, a portion of the enclosure is removable to allow access to the circuitry, such as the multichip module, mounted on the flexible circuit in the circuit volume.