The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 1995
Filed:
Sep. 01, 1993
Applicant:
Inventors:
Yoshihiko Koike, Hitachi, JP;
Ryuichi Saito, Hitachi, JP;
Sigeki Sekine, Hitachi, JP;
Yuuji Wakisawa, Hitachi, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257707 ; 257724 ;
Abstract
A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.