The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 1995

Filed:

Apr. 13, 1993
Applicant:
Inventors:

Douglas W Romm, Sherman, TX (US);

Larry W Nye, Sherman, TX (US);

Michael R Head, Colbert, OK (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F26B / ;
U.S. Cl.
CPC ...
34233 ; 34218 ; 34239 ; 34487 ;
Abstract

The invention is directed to a manifold 10 that is used in conjunction with a die attach cure station for providing a 'quick cure' of the die mount adhesive, and for forcing contaminants away from the semiconductor die 33 surface. The manifold has an air put port 21 directly above the semiconductor die. Forced air is directed through the port. At each side of the forced port are vacuum ports 20,22 through which a vacuum is applied to draw air and heated die attach contaminants from the die surface. Air is also drawn from below and around the die mounting area to provide a stream of air that is drawn into the vacuum ports.


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