The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1995
Filed:
Apr. 05, 1994
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R / ; G01R / ;
U.S. Cl.
CPC ...
324755 ; 324 725 ; 437-8 ; 29825 ; 439482 ; 333246 ;
Abstract
A semiconductor apparatus for functionally inspecting semiconductor devices is designed to prevent contact failure, deformation, and the like caused by solder transferred from external leads of semiconductor devices and deposited on contact terminals of the inspection apparatus. A sheet having metal-film patterns corresponding to an array of external leads of a semiconductor device is interposed between the external leads and the contact terminals to electrically connect the external leads to the contact terminals. The semiconductor device is inspected and the sheet is changed at a suitable time when it is contaminated with solder.