The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1995
Filed:
Aug. 10, 1994
Jonathon Greenwood, Boynton Beach, FL (US);
Douglas W Hendricks, Boca Raton, FL (US);
Frank Juskey, Coral Springs, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A wire bond pad arrangement (104) has an improved pad density for providing a plurality of wire bond terminations for interconnection with corresponding terminations (604) of an IC chip (302. The wire bond pad arrangement (104) includes a substrate (102) and a plurality of pads (912) disposed on the substrate (102) adjacent to one another to form a row of pads (912). Each of the pads (912) is formed in a trapezoidal shape having short and long sides parallel to one another and substantially perpendicular to a line from a central point of the pad (912) to a central point of the corresponding termination (604) of the IC chip (302). The long sides of adjacent pads (912) are positioned alternately towards and away from the corresponding terminations (604) of the IC chip 302).