The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1995
Filed:
Nov. 22, 1993
Sunil Kaul, Fremont, CA (US);
Douglas A Laird, Los Gatos, CA (US);
Sun Microsystems, Inc., Mountain View, CA (US);
Abstract
A package and packaging technique for enhancing performance of critical chips within an electronic device, wherein the critical chips comprise an integrated circuit. The package includes a main package incorporating a first integrated circuit coupled to a substrate board. At least one package having a second integrated circuit is mounted to the main package in order to reduce (i) propagation delay for data to transfer between critical chips within the main package and one of the plurality of packages or between the critical chips within the plurality of packages and (ii) total footprint area. The method for implementing such a package including the steps of packaging the first and second integrated circuits and electrically coupling these integrating circuits together in a mounted position.