The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1995
Filed:
Feb. 03, 1994
Applicant:
Inventor:
Motomi Ichihashi, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257420 ; 257710 ; 73754 ;
Abstract
A semiconductor pressure sensor has a package base provided with an adhesive supporting portion for supporting nearly the entire lengths of inner portions of outer leads. Since nearly the entire lengths of the inner portions in a package are supported, the inner portions do not resonate even if the semiconductor pressure sensor vibrates, thereby preventing detachment of the wires bonded to the ends of the inner portions.
Ichihashi, Motomi. (1995). Packaged semiconductor pressure sensor including lead supports within (U.S. Patent No. 5444286). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5444286
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile