The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1995
Filed:
Dec. 23, 1993
Robert M Schlingman, Mount Vernon, WA (US);
Tempress Incorporated, Seattle, WA (US);
Abstract
A method for reducing the occurrence of voids and areas of porosity in injection molded parts. Vents are placed within the injection mold near areas of the molded part that are prone to the occurrence of voids and areas of porosity. A porous flow regulator is placed adjacent the vents to regulate the flow of the resin near the vent. The flow regulator allows air trapped within the mold to escape through the vents during molding. Allowing air trapped within the mold to escape reduces the occurrence of voids and areas of porosity in the molded part. A porous plug extends through the flow regulator and into the vent. The porous plug prevents excess quantities of resin from flowing out of the vent, thus reducing waste and also helping to maintain the flow regulator in place.