The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1995
Filed:
Apr. 06, 1993
H Ravindranath Shetty, Warsaw, IN (US);
Clarence M Panchison, Warsaw, IN (US);
Zimmer, Inc., Warsaw, IN (US);
Abstract
The method forms a thin layer of metal mesh on the surface of the implant for the bonding with a porous surface layer to prevent the formation of notches within the body of the implant. The layer of metal mesh can be formed by a number of known methods including conventional welding processes such as arc welding, resistance welding, electron beam welding, laser beam welding, friction welding, ultrasonic welding, cladding. The porous metal surface layer is preferably formed from titanium wire or titanium beads in a known process. The porous surface layer is bonded by a known process such as diffusion bonding, sintering, welding, or cladding. By bonding the porous surface layer to the thin layer of metal mesh, notches normally formed in the body of the implant are substantially eliminated. Therefore, the designer of the implant is not limited as to the location and amount of porous surface layer to be placed on the implants.