The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 1995

Filed:

Sep. 30, 1992
Applicant:
Inventors:

Takashi Miyamoto, Itami, JP;

Hitoshi Fujimoto, Itami, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257668 ; 257666 ; 257690 ; 257692 ; 257784 ; 257786 ;
Abstract

A semiconductor device capable of accommodating a larger semiconductor chip in its package than a comparable conventional device and providing flexibility in the design of the semiconductor chip. An insulating tape includes an opening which receives a plurality of electrode pads disposed on the central part of the top surface of the semiconductor chip. The insulating tape is disposed between the semiconductor chip and inner leads of a lead frame. Circuit pattern traces are present on top of the insulating tape. The inner end of each circuit pattern trace is connected to a corresponding electrode pad with a fine metallic wire, and the outer end of each circuit pattern trace is connected to the corresponding inner lead.


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