The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 1995
Filed:
Nov. 22, 1991
Applicant:
Inventors:
Satoru Murase, Yokohama, JP;
Shigeo Nakayama, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B / ;
U.S. Cl.
CPC ...
1741251 ; 505884 ; 505887 ;
Abstract
A housing is arranged outside a superconducting wire body to enclose it at a predetermined gap. A solder layer and/or a space are formed as a stress relaxation layer between the superconducting wire body and the housing. The gap between a surface of the superconducting wire body, to which a load acts in a direction perpendicular to the longitudinal direction of the superconducting wire body, and a housing material layer, is set to at least 0.25 mm at each side. Alternatively, a solder layer is formed to leave a space between a surface of the superconducting wire body, to which the above load mainly acts, and the housing material layer.